ASML says customer orders for 2027 and 2028 already exceed its expansion plans, with some clients asking about 2029 and 2030. The Dutch giant will lift output of EUV and immersion DUV machines by 30 percent next year.
JPMorgan projects the traditional 60% stocks, 40% bonds mix will return about 7% a year over the next 10 to 15 years. The forecast lands as global markets diverge and tech stocks lead while metals trade mixed.
Samsung will use TSMC's 3-nanometer technology to build the base die for Nvidia's next custom high-bandwidth memory, breaking its one-stop manufacturing model. The move follows Nvidia's request that all three HBM suppliers adopt TSMC's process.
SoftBank is reportedly exploring a takeover of Allied Universal that could value the security giant at up to $18 billion in equity, with debt pushing the total near $30 billion. The news sent SoftBank's ADR down as much as 9.4%.
Changxin Technology expects about 130 billion yuan in net profit for the first nine months of 2026, reversing years of losses as AI demand sends memory chip prices soaring.
Applied Materials laid out long-term targets on October 14, projecting service revenue above $12 billion by 2030 and a bigger share of the wafer fab equipment market. The US chip toolmaker also pledged to return most of its free cash flow to shareholders.
America's latest short-term debt sales cleared with healthy bid-to-cover ratios while WTI crude rose toward $95 a barrel. The mix of firm demand for government paper and rising energy prices frames the week for global investors.
Canyon Semiconductor will begin trading on Shenzhen's ChiNext board on October 13, pricing shares at 12.01 yuan each in a listing that underscores China's push for domestic chip capacity.
Samsung Electronics reported a third-quarter operating profit of 107.4 trillion won, up 783% year on year, though revenue of 195 trillion won fell short of analyst estimates. The numbers show how much of the global memory market now runs on AI data-center spending.
Taiwan's chipmaking giant is in talks with Elon Musk's Terafab wafer project, with Musk confirming discussions are underway. The move could reshape where advanced chips for Tesla and SpaceX get built.
As AI data centers demand ever-faster memory, storage chips are emerging as the bottleneck that decides how efficiently computing power gets used. Chinese investors poured 1.93 billion yuan into the sector in a single day as DDR5, HBM and 3D NAND upgrades reshape the industry.
Guangzhou-based chipmaker CanSemi priced its Shenzhen IPO, and 358,848 lottery numbers won the right to buy shares — a window into how Chinese retail investors chase semiconductor listings. Winners must fund their accounts by September 29 or forfeit.
Half-year results show Chinese listed companies' profits accelerating in the second quarter of 2026, with semiconductors, metals and brokerages leading gains while consumer names lag. The recovery is spreading across more industries, though the picture remains uneven.
A Chinese-led research team says it has fixed the durability flaw in ferroelectric memory, pushing devices past 10 billion read-write cycles. The advance could bring faster, power-sipping storage closer to everyday chips.
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